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M386ABG40M50-CYF

Samsung Semiconductor M386ABG40M50-CYF

Part No:

M386ABG40M50-CYF

Datasheet:

-

Package:

-

AINNX NO:

32031197-M386ABG40M50-CYF

Description:

Products specifications
  • HTS
    8473.30.11.40
  • Automotive
    No
  • PPAP
    No
  • Module
    DRAM Module
  • Module Density
    256Gbyte
  • Number of Chip per Module
    36
  • Chip Density (bit)
    64G
  • Maximum Clock Rate (MHz)
    2933
  • Chip Configuration
    16Gx4
  • Typical Operating Supply Voltage (V)
    1.2
  • Number of Ranks
    Octal
  • Part Status

    Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

    Preliminary
  • Module Type
    288LRDIMM
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Pricing & Ordering

  • Quantity

    Unit Price

    Ext. Price

  • 1+

    $7,619.280425

    $7,619.30

  • 10+

    $7,188.000364

    $71,879.98

  • 100+

    $6,781.132476

    $678,113.23

  • 500+

    $6,397.294782

    $3,198,647.33

  • 1000+

    $6,035.183726

    $6,035,183.74

* The above prices does not include taxes and freight rates, which will be calculated on the order pages.

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