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M386ABG40M50-CYF

Samsung Semiconductor M386ABG40M50-CYF

Part No:

M386ABG40M50-CYF

Datasheet:

-

Package:

-

AINNX NO:

32031197-M386ABG40M50-CYF

Description:

Products specifications
  • HTS
    8473.30.11.40
  • Automotive
    No
  • PPAP
    No
  • Module
    DRAM Module
  • Module Density
    256Gbyte
  • Number of Chip per Module
    36
  • Chip Density (bit)
    64G
  • Maximum Clock Rate (MHz)
    2933
  • Chip Configuration
    16Gx4
  • Typical Operating Supply Voltage (V)
    1.2
  • Number of Ranks
    Octal
  • Part Status

    Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

    Preliminary
  • Module Type
    288LRDIMM
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