M378B1G73EB0-CK0

Samsung Semiconductor M378B1G73EB0-CK0

Part No:

M378B1G73EB0-CK0

Datasheet:

-

Package:

-

AINNX NO:

32031240-M378B1G73EB0-CK0

Description:

Products specifications
  • Surface Mount

    having leads that are designed to be soldered on the side of a circuit board that the body of the component is mounted on.

    NO
  • Number of Terminals
    240
  • EU RoHS
    Compliant
  • Automotive
    No
  • PPAP
    No
  • Mounting
    Socket
  • Package Height
    30
  • Package Width
    4(Max)
  • Package Length
    133.35
  • PCB changed
    240
  • Supplier Package
    UDIMM
  • Package Description
    DIMM,
  • Package Style
    MICROELECTRONIC ASSEMBLY
  • Number of Words Code
    1000000000
  • Package Body Material
    UNSPECIFIED
  • Access Time-Max
    0.1 ns
  • Rohs Code
    Yes
  • Manufacturer Part Number
    M378B1G73EB0-CK0
  • Number of Words
    1073741824 words
  • Supply Voltage-Nom (Vsup)
    1.5 V
  • Package Code
    DIMM
  • Package Shape
    RECTANGULAR
  • Manufacturer
    Samsung Semiconductor
  • Part Life Cycle Code
    Active
  • Ihs Manufacturer
    SAMSUNG SEMICONDUCTOR INC
  • Risk Rank
    5.74
  • Part Status

    Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

    Unconfirmed
  • ECCN Code
    EAR99
  • Additional Feature

    Any Feature, including a modified Existing Feature, that is not an Existing Feature.

    AUTO/SELF REFRESH; WD-MAX
  • Technology
    CMOS
  • Terminal Position
    DUAL
  • Terminal Form

    Occurring at or forming the end of a series, succession, or the like; closing; concluding.

    NO LEAD
  • Number of Functions
    1
  • Terminal Pitch

    The center distance from one pole to the next.

    1 mm
  • Reach Compliance Code
    compliant
  • Pin Count

    a count of all of the component leads (or pins)

    240
  • JESD-30 Code
    R-XDMA-N240
  • Supply Voltage-Max (Vsup)
    1.575 V
  • Supply Voltage-Min (Vsup)
    1.425 V
  • Number of Ports

    A port is identified for each transport protocol and address combination by a 16-bit unsigned number,.

    1
  • Operating Mode

    A phase of operation during the operation and maintenance stages of the life cycle of a facility.

    SYNCHRONOUS
  • Organization
    1GX64
  • Seated Height-Max
    30.15 mm
  • Memory Width
    64
  • Memory Density
    68719476736 bit
  • Memory IC Type
    DDR DRAM MODULE
  • Access Mode

    Distinct operation recognized by the protection mechanisms as a possible operation on an object.

    DUAL BANK PAGE BURST
  • Self Refresh
    YES
  • Width
    4 mm
  • Length
    133.35 mm
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