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M378B1G73BH0-CK0

Samsung Semiconductor M378B1G73BH0-CK0

Part No:

M378B1G73BH0-CK0

Manufacturer:

Samsung Semiconductor

Datasheet:

Package:

-

AINNX NO:

32031182-M378B1G73BH0-CK0

Category:

Memory - Modules

Description:

Products specifications

EU RoHS
Compliant
ECCN (US)
4A994.a
Automotive
No
PPAP
No
Module
DRAM Module
Module Density
8Gbyte
Number of Chip per Module
16
Chip Density (bit)
4G
Data Bus Width (bit)
64
Max. Access Time (ns)
0.225
Maximum Clock Rate (MHz)
1600
Chip Configuration
512Mx8
Minimum Operating Supply Voltage (V)
1.425
Typical Operating Supply Voltage (V)
1.5
Maximum Operating Supply Voltage (V)
1.575
Operating Current (mA)
1040
Minimum Operating Temperature (°C)
0
Maximum Operating Temperature (°C)
95
Module Sides
Double
ECC Support
No
Number of Ranks
Dual
Number of Chip Banks
8
CAS Latency
11
SPD EEPROM Support
Yes
Mounting
Socket
Package Height
30
Package Width
4(Max)
Package Length
133.35
PCB changed
240
Supplier Package
UDIMM
Lead Shape
No Lead
Part Status
Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.
Obsolete
Pin Count
a count of all of the component leads (or pins)
240
Organization
1Gx64
PLL
No
Self Refresh
Yes
Module Type
240UDIMM

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