Samsung K4H561638H-UCB3

Surface Mount

having leads that are designed to be soldered on the side of a circuit board that the body of the component is mounted on.

YES

Number of Terminals

66

RoHS

Compliant

Package Style

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Moisture Sensitivity Levels

3

Number of Words Code

16000000

Package Body Material

PLASTIC/EPOXY

Package Equivalence Code

TSSOP66,.46

Reflow Temperature-Max (s)

40

Access Time-Max

0.7 ns

Operating Temperature-Max

70 °C

Rohs Code

Yes

Manufacturer Part Number

K4H561638H-UCB3

Clock Frequency-Max (fCLK)

166 MHz

Number of Words

16777216 words

Supply Voltage-Nom (Vsup)

2.3 V

Package Code

TSSOP

Package Shape

RECTANGULAR

Manufacturer

Samsung Semiconductor

Part Life Cycle Code

Obsolete

Ihs Manufacturer

SAMSUNG SEMICONDUCTOR INC

Risk Rank

5.79

JESD-609 Code

e6

Pbfree Code

Yes

Terminal Finish

Tin/Bismuth (Sn97Bi3)

Subcategory

DRAMs

Technology

CMOS

Terminal Position

DUAL

Terminal Form

Occurring at or forming the end of a series, succession, or the like; closing; concluding.

GULL WING

Peak Reflow Temperature (Cel)

260

Terminal Pitch

The center distance from one pole to the next.

0.635 mm

Reach Compliance Code

unknown

Frequency

166 MHz

JESD-30 Code

R-PDSO-G66

Qualification Status

An indicator of formal certification of qualifications.

Not Qualified

Power Supplies

an electronic circuit that converts the voltage of an alternating current (AC) into a direct current (DC) voltage.?

2.3 V

Temperature Grade

Temperature grades represent a tire's resistance to heat and its ability to dissipate heat when tested under controlled laboratory test conditions.

COMMERCIAL

Supply Current-Max

0.33 mA

Organization

16MX16

Output Characteristics

3-STATE

Memory Width

16

Standby Current-Max

0.003 A

Memory Density

268435456 bit

I/O Type

COMMON

Memory IC Type

DDR DRAM

Refresh Cycles

8192

Sequential Burst Length

2,4,8

Interleaved Burst Length

2,4,8

Lead Free

Lead Free