Samsung K4B1G1646G-BCH9

Surface Mount

having leads that are designed to be soldered on the side of a circuit board that the body of the component is mounted on.

YES

Number of Terminals

96

Package Description

FBGA, BGA96,9X16,32

Package Style

GRID ARRAY, FINE PITCH

Moisture Sensitivity Levels

3

Number of Words Code

64000000

Package Body Material

PLASTIC/EPOXY

Package Equivalence Code

BGA96,9X16,32

Reflow Temperature-Max (s)

NOT SPECIFIED

Access Time-Max

0.255 ns

Rohs Code

Yes

Manufacturer Part Number

K4B1G1646G-BCH9

Clock Frequency-Max (fCLK)

667 MHz

Number of Words

67108864 words

Supply Voltage-Nom (Vsup)

1.5 V

Package Code

FBGA

Package Shape

RECTANGULAR

Manufacturer

Samsung Semiconductor

Part Life Cycle Code

Obsolete

Ihs Manufacturer

SAMSUNG SEMICONDUCTOR INC

Risk Rank

8.58

JESD-609 Code

e1

Pbfree Code

Yes

Terminal Finish

Tin/Silver/Copper (Sn/Ag/Cu)

Subcategory

DRAMs

Technology

CMOS

Terminal Position

BOTTOM

Terminal Form

Occurring at or forming the end of a series, succession, or the like; closing; concluding.

BALL

Peak Reflow Temperature (Cel)

225

Terminal Pitch

The center distance from one pole to the next.

0.8 mm

Reach Compliance Code

compliant

JESD-30 Code

R-PBGA-B96

Qualification Status

An indicator of formal certification of qualifications.

Not Qualified

Power Supplies

an electronic circuit that converts the voltage of an alternating current (AC) into a direct current (DC) voltage.?

1.5 V

Supply Current-Max

0.17 mA

Organization

64MX16

Output Characteristics

3-STATE

Memory Width

16

Standby Current-Max

0.01 A

Memory Density

1073741824 bit

I/O Type

COMMON

Memory IC Type

DDR DRAM

Refresh Cycles

8192

Sequential Burst Length

4,8

Interleaved Burst Length

4,8