Samsung K4B2G0846D-HCH9

Surface Mount

having leads that are designed to be soldered on the side of a circuit board that the body of the component is mounted on.

YES

Number of Terminals

78

Package Description

FBGA, BGA78,9X13,32

Package Style

GRID ARRAY, FINE PITCH

Number of Words Code

256000000

Package Body Material

PLASTIC/EPOXY

Package Equivalence Code

BGA78,9X13,32

Access Time-Max

0.255 ns

Operating Temperature-Max

85 °C

Rohs Code

Yes

Manufacturer Part Number

K4B2G0846D-HCH9

Clock Frequency-Max (fCLK)

667 MHz

Number of Words

268435456 words

Supply Voltage-Nom (Vsup)

1.5 V

Package Code

FBGA

Package Shape

RECTANGULAR

Manufacturer

Samsung Semiconductor

Part Life Cycle Code

Obsolete

Ihs Manufacturer

SAMSUNG SEMICONDUCTOR INC

Risk Rank

5.79

Subcategory

DRAMs

Technology

CMOS

Terminal Position

BOTTOM

Terminal Form

Occurring at or forming the end of a series, succession, or the like; closing; concluding.

BALL

Terminal Pitch

The center distance from one pole to the next.

0.8 mm

Reach Compliance Code

compliant

JESD-30 Code

R-PBGA-B78

Qualification Status

An indicator of formal certification of qualifications.

Not Qualified

Power Supplies

an electronic circuit that converts the voltage of an alternating current (AC) into a direct current (DC) voltage.?

1.5 V

Temperature Grade

Temperature grades represent a tire's resistance to heat and its ability to dissipate heat when tested under controlled laboratory test conditions.

OTHER

Supply Current-Max

0.135 mA

Organization

256MX8

Output Characteristics

3-STATE

Memory Width

8

Standby Current-Max

0.012 A

Memory Density

2147483648 bit

I/O Type

COMMON

Memory IC Type

DDR DRAM

Refresh Cycles

8192

Sequential Burst Length

8

Interleaved Burst Length

8