TH930-50G-4JAR

Penchem Technologies Sdn Bhd TH930-50G-4JAR

Part No:

TH930-50G-4JAR

Datasheet:

-

Package:

-

AINNX NO:

69852700-TH930-50G-4JAR

Description:

SILICONE THERMAL PUTTY (4 PACKS)

Products specifications
  • Series
    TH930
  • Packaging

    Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

    Bottle
  • Size / Dimension
    50 gram Jar
  • Part Status

    Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

    Active
  • Type
    Silicone Putty
  • Color
    White
  • Shelf Life
    18 Months
  • Shelf Life Start
    Date of Manufacture
  • Thermal Conductivity

    a measure of a material's ability to?conduct heat.?

    5.00W/m-K
  • Usable Temperature Range
    -76°F ~ 392°F (-60°C ~ 200°C)
  • Material Flammability Rating
    UL94 V-0
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