TH855-5-50G-4JAR

Penchem Technologies Sdn Bhd TH855-5-50G-4JAR

Part No:

TH855-5-50G-4JAR

Datasheet:

-

Package:

-

AINNX NO:

69848667-TH855-5-50G-4JAR

Description:

SILICONE THERMAL PUTTY (4 PACKS)

Products specifications
  • Series
    TH855-5LB
  • Packaging

    Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

    Bottle
  • Size / Dimension
    50 gram Jar
  • Part Status

    Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

    Active
  • Type
    Silicone Putty
  • Color
    Gray
  • Shelf Life
    18 Months
  • Thermal Conductivity

    a measure of a material's ability to?conduct heat.?

    5.00W/m-K
  • Usable Temperature Range
    -40°F ~ 392°F (-40°C ~ 200°C)
0 Similar Products Remaining