Penchem Technologies Sdn Bhd TH235-2-50G-2JAR

Series

TH235-2

Packaging

Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

Bottle

Size / Dimension

50 gram Jar

Part Status

Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

Active

Type

Non-Silicone Putty

Color

Blue

Shelf Life

18 Months

Thermal Conductivity

a measure of a material's ability to?conduct heat.?

4.00W/m-K

Usable Temperature Range

5°F ~ 248°F (-15°C ~ 200°C)