NXP USA Inc. BSS83

Surface Mount

having leads that are designed to be soldered on the side of a circuit board that the body of the component is mounted on.

YES

Number of Terminals

4

Transistor Element Material

SILICON

Package Description

SMALL OUTLINE, R-PDSO-G4

Package Style

SMALL OUTLINE

Moisture Sensitivity Levels

1

Package Body Material

PLASTIC/EPOXY

Reflow Temperature-Max (s)

30

Operating Temperature-Max

125 °C

Rohs Code

Yes

Manufacturer Part Number

BSS83

Package Shape

RECTANGULAR

Manufacturer

NXP Semiconductors

Number of Elements

1

Part Life Cycle Code

Obsolete

Ihs Manufacturer

NXP SEMICONDUCTORS

Risk Rank

7.87

Part Package Code

SOT-143

Drain Current-Max (ID)

0.05 A

JESD-609 Code

e3

Pbfree Code

Yes

ECCN Code

EAR99

Terminal Finish

Tin (Sn)

HTS Code

HTS (Harmonized Tariff Schedule) codes are product classification codes between 8-1 digits. The first six digits are an HS code, and the countries of import assign the subsequent digits to provide additional classification. U.S. HTS codes are 1 digits and are administered by the U.S. International Trade Commission.

8541.21.00.95

Subcategory

FET General Purpose Power

Terminal Position

DUAL

Terminal Form

Occurring at or forming the end of a series, succession, or the like; closing; concluding.

GULL WING

Peak Reflow Temperature (Cel)

260

Reach Compliance Code

compliant

Pin Count

a count of all of the component leads (or pins)

4

JESD-30 Code

R-PDSO-G4

Qualification Status

An indicator of formal certification of qualifications.

Not Qualified

Configuration

SINGLE WITH BUILT-IN DIODE

Operating Mode

A phase of operation during the operation and maintenance stages of the life cycle of a facility.

ENHANCEMENT MODE

Case Connection

SUBSTRATE

Transistor Application

SWITCHING

Polarity/Channel Type

N-CHANNEL

Drain Current-Max (Abs) (ID)

0.05 A

Drain-source On Resistance-Max

120 Ω

DS Breakdown Voltage-Min

10 V

FET Technology

METAL-OXIDE SEMICONDUCTOR

Power Dissipation-Max (Abs)

0.23 W