NXP USA Inc. BUK7219-55A

Surface Mount

having leads that are designed to be soldered on the side of a circuit board that the body of the component is mounted on.

YES

Number of Terminals

2

Transistor Element Material

SILICON

Package Description

PLASTIC, TO-252, SC-63, DPAK, 3 PIN

Package Style

SMALL OUTLINE

Moisture Sensitivity Levels

1

Package Body Material

PLASTIC/EPOXY

Reflow Temperature-Max (s)

NOT SPECIFIED

Operating Temperature-Max

175 °C

Rohs Code

Yes

Manufacturer Part Number

BUK7219-55A

Package Shape

RECTANGULAR

Manufacturer

NXP Semiconductors

Number of Elements

1

Part Life Cycle Code

Transferred

Ihs Manufacturer

NXP SEMICONDUCTORS

Risk Rank

5.23

Part Package Code

TO-252AA

Drain Current-Max (ID)

55 A

JESD-609 Code

e3

Pbfree Code

Yes

ECCN Code

EAR99

Terminal Finish

Tin (Sn)

Subcategory

FET General Purpose Power

Terminal Position

SINGLE

Terminal Form

Occurring at or forming the end of a series, succession, or the like; closing; concluding.

GULL WING

Peak Reflow Temperature (Cel)

NOT SPECIFIED

Reach Compliance Code

not_compliant

Pin Count

a count of all of the component leads (or pins)

3

JESD-30 Code

R-PSSO-G2

Qualification Status

An indicator of formal certification of qualifications.

Not Qualified

Configuration

SINGLE WITH BUILT-IN DIODE

Operating Mode

A phase of operation during the operation and maintenance stages of the life cycle of a facility.

ENHANCEMENT MODE

Case Connection

DRAIN

Transistor Application

SWITCHING

Polarity/Channel Type

N-CHANNEL

JEDEC-95 Code

TO-252AA

Drain Current-Max (Abs) (ID)

55 A

Drain-source On Resistance-Max

0.019 Ω

Pulsed Drain Current-Max (IDM)

250 A

DS Breakdown Voltage-Min

55 V

Avalanche Energy Rating (Eas)

120 mJ

FET Technology

METAL-OXIDE SEMICONDUCTOR

Power Dissipation-Max (Abs)

114 W