NXP USA Inc. BSS138AKA

Surface Mount

having leads that are designed to be soldered on the side of a circuit board that the body of the component is mounted on.

YES

Number of Terminals

3

Transistor Element Material

SILICON

Package Description

PLASTIC PACKAGE-3

Package Style

SMALL OUTLINE

Moisture Sensitivity Levels

1

Package Body Material

PLASTIC/EPOXY

Reflow Temperature-Max (s)

30

Rohs Code

Yes

Manufacturer Part Number

BSS138AKA

Package Shape

RECTANGULAR

Manufacturer

NXP Semiconductors

Number of Elements

1

Part Life Cycle Code

Transferred

Ihs Manufacturer

NXP SEMICONDUCTORS

Risk Rank

7.76

Drain Current-Max (ID)

0.2 A

JESD-609 Code

e3

ECCN Code

EAR99

Terminal Finish

TIN

Terminal Position

DUAL

Terminal Form

Occurring at or forming the end of a series, succession, or the like; closing; concluding.

GULL WING

Peak Reflow Temperature (Cel)

260

Reach Compliance Code

unknown

Reference Standard

AEC-Q101; IEC-60134

JESD-30 Code

R-PDSO-G3

Configuration

SINGLE WITH BUILT-IN DIODE

Operating Mode

A phase of operation during the operation and maintenance stages of the life cycle of a facility.

ENHANCEMENT MODE

Transistor Application

SWITCHING

Polarity/Channel Type

N-CHANNEL

JEDEC-95 Code

TO-236AB

Drain-source On Resistance-Max

5.2 Ω

DS Breakdown Voltage-Min

60 V

FET Technology

METAL-OXIDE SEMICONDUCTOR