NXP USA Inc. BLF6G38-10G,118

Surface Mount

having leads that are designed to be soldered on the side of a circuit board that the body of the component is mounted on.

YES

Number of Terminals

2

Transistor Element Material

SILICON

Package Description

SMALL OUTLINE, S-CDSO-G2

Package Style

SMALL OUTLINE

Package Body Material

CERAMIC, METAL-SEALED COFIRED

Reflow Temperature-Max (s)

NOT SPECIFIED

Rohs Code

Yes

Manufacturer Part Number

BLF6G38-10G,118

Package Shape

SQUARE

Manufacturer

Ampleon

Number of Elements

1

Part Life Cycle Code

Obsolete

Ihs Manufacturer

AMPLEON NETHERLANDS B V

Risk Rank

7.47

Drain Current-Max (ID)

3.1 A

ECCN Code

EAR99

Terminal Position

DUAL

Terminal Form

Occurring at or forming the end of a series, succession, or the like; closing; concluding.

GULL WING

Peak Reflow Temperature (Cel)

NOT SPECIFIED

Reach Compliance Code

unknown

Reference Standard

IEC-60134

JESD-30 Code

S-CDSO-G2

Configuration

SINGLE

Operating Mode

A phase of operation during the operation and maintenance stages of the life cycle of a facility.

ENHANCEMENT MODE

Case Connection

SOURCE

Transistor Application

AMPLIFIER

Polarity/Channel Type

N-CHANNEL

DS Breakdown Voltage-Min

65 V

FET Technology

METAL-OXIDE SEMICONDUCTOR

Highest Frequency Band

L BAND