NXP USA Inc. 2N7002P,215

Package / Case

TO-236-3, SC-59, SOT-23-3

Mounting Type

Surface Mount

Supplier Device Package

SOT-23 (TO-236AB)

RoHS

Lead free / RoHS Compliant

PCN Packaging

Lighter Reels 02/Jan/2014

Input Capacitance (Ciss) @ Vds

50pF @ 10V

Online Catalog

N-Channel Logic Level Gate FETs

Current - Continuous Drain (Id) @ 25℃

360mA (Ta)

PCN Design/Specification

Resin Hardener 02/Jul/2013

Gate Charge (Qg) @ Vgs

0.8nC @ 4.5V

Standard Package

3,000

Packaging

Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

Tape & Reel (TR)

Power - Max

350mW

Family

FETs - Single

FET Type

MOSFET N-Channel, Metal Oxide

Rds On (Max) @ Id, Vgs

1.6 Ohm @ 500mA, 10V

Vgs(th) (Max) @ Id

2.4V @ 250碌A

Drain to Source Voltage (Vdss)

60V

FET Feature

Logic Level Gate