NXP Semiconductors MIMXRT1064DVL6B

Factory Lead Time

4 Weeks

Surface Mount

having leads that are designed to be soldered on the side of a circuit board that the body of the component is mounted on.

YES

Number of Terminals

196

Rohs Code

Yes

Part Life Cycle Code

Active

Ihs Manufacturer

NXP SEMICONDUCTORS

Package Description

MAPBGA-196

Clock Frequency-Max

24 MHz

Moisture Sensitivity Levels

3

Operating Temperature-Max

85 °C

Package Body Material

PLASTIC/EPOXY

Package Code

LFBGA

Package Equivalence Code

BGA196,14X14,25

Package Shape

SQUARE

Package Style

GRID ARRAY, LOW PROFILE, FINE PITCH

Supply Voltage-Max

1.3 V

Supply Voltage-Min

1.25 V

Terminal Position

BOTTOM

Terminal Form

Occurring at or forming the end of a series, succession, or the like; closing; concluding.

BALL

Peak Reflow Temperature (Cel)

260

Terminal Pitch

The center distance from one pole to the next.

0.65 mm

Reach Compliance Code

compliant

Time@Peak Reflow Temperature-Max (s)

40

JESD-30 Code

S-PBGA-B196

Temperature Grade

Temperature grades represent a tire's resistance to heat and its ability to dissipate heat when tested under controlled laboratory test conditions.

OTHER

Speed

600 MHz

uPs/uCs/Peripheral ICs Type

MICROPROCESSOR, RISC

Supply Current-Max

110 mA

Bit Size

32

Seated Height-Max

1.43 mm

Boundary Scan

YES

Low Power Mode

YES

Format

FLOATING-POINT

Integrated Cache

YES

RAM (words)

1048576

Number of Serial I/Os

10

On Chip Data RAM Width

8

Number of DMA Channels

32

Length

10 mm

Width

10 mm