XPC823ZT50Z3

NXP Semiconductors XPC823ZT50Z3

Part No:

XPC823ZT50Z3

Manufacturer:

NXP Semiconductors

Datasheet:

Package:

-

AINNX NO:

69133422-XPC823ZT50Z3

Description:

MICROPROCESSOR

Products specifications
  • Surface Mount

    having leads that are designed to be soldered on the side of a circuit board that the body of the component is mounted on.

    YES
  • Number of Terminals
    256
  • Part Life Cycle Code
    Obsolete
  • Ihs Manufacturer
    NXP SEMICONDUCTORS
  • Package Description
    BGA,
  • Operating Temperature-Max
    70 °C
  • Package Body Material
    PLASTIC/EPOXY
  • Package Code
    BGA
  • Package Shape
    SQUARE
  • Package Style
    GRID ARRAY
  • HTS Code

    HTS (Harmonized Tariff Schedule) codes are product classification codes between 8-1 digits. The first six digits are an HS code, and the countries of import assign the subsequent digits to provide additional classification. U.S. HTS codes are 1 digits and are administered by the U.S. International Trade Commission.

    8542.31.00.01
  • Terminal Position
    BOTTOM
  • Terminal Form

    Occurring at or forming the end of a series, succession, or the like; closing; concluding.

    BALL
  • Reach Compliance Code
    unknown
  • JESD-30 Code
    S-PBGA-B256
  • Temperature Grade

    Temperature grades represent a tire's resistance to heat and its ability to dissipate heat when tested under controlled laboratory test conditions.

    COMMERCIAL
  • Speed
    50 MHz
  • uPs/uCs/Peripheral ICs Type
    MICROPROCESSOR
  • Bit Size
    32
  • Boundary Scan
    YES
  • Low Power Mode
    YES
  • Format
    FIXED POINT
  • Integrated Cache
    YES
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