NXP Semiconductors FS32R274KSK2MMM

Factory Lead Time

4 Weeks

Surface Mount

having leads that are designed to be soldered on the side of a circuit board that the body of the component is mounted on.

YES

Number of Terminals

257

Supply Voltage-Nom

1.25 V

Supply Voltage-Min

1.19 V

Supply Voltage-Max

1.31 V

Package Style

GRID ARRAY, LOW PROFILE, FINE PITCH

Package Shape

SQUARE

Package Equivalence Code

BGA257,17X17,32

Package Code

LFBGA

Package Body Material

PLASTIC/EPOXY

Operating Temperature-Min

-40 °C

Operating Temperature-Max

125 °C

Moisture Sensitivity Levels

3

Clock Frequency-Max

40 MHz

Date Of Intro

2018-06-21

Package Description

MABGA-257

Ihs Manufacturer

NXP SEMICONDUCTORS

Part Life Cycle Code

Active

Rohs Code

Yes

JESD-609 Code

e2

ECCN Code

5A992.C

Terminal Finish

Tin/Silver (Sn/Ag)

HTS Code

HTS (Harmonized Tariff Schedule) codes are product classification codes between 8-1 digits. The first six digits are an HS code, and the countries of import assign the subsequent digits to provide additional classification. U.S. HTS codes are 1 digits and are administered by the U.S. International Trade Commission.

8542.31.00.01

Terminal Position

BOTTOM

Terminal Form

Occurring at or forming the end of a series, succession, or the like; closing; concluding.

BALL

Peak Reflow Temperature (Cel)

260

Terminal Pitch

The center distance from one pole to the next.

0.8 mm

Reach Compliance Code

compliant

Time@Peak Reflow Temperature-Max (s)

40

JESD-30 Code

S-PBGA-B257

Speed

240 MHz

uPs/uCs/Peripheral ICs Type

MICROPROCESSOR, RISC

Supply Current-Max

1642 mA

Bit Size

32

Seated Height-Max

1.51 mm

Boundary Scan

YES

Low Power Mode

YES

Screening Level

ISO 26262

Format

FLOATING-POINT

Integrated Cache

YES

RAM (words)

1572864

Number of External Interrupts

1

On Chip Data RAM Width

8

Number of DMA Channels

32

Width

14 mm

Length

14 mm