NXP Semiconductors BAT54S,215

ECCN (US)

EAR99

HTS

8541.10.00.80

Maximum DC Reverse Voltage (V)

30

Maximum Continuous Forward Current (A)

0.2

Peak Non-Repetitive Surge Current (A)

0.6

Peak Forward Voltage (V)

Peak Reverse Current (uA)

2@25V

Maximum Junction Ambient Thermal Resistance

500K/W

Maximum Diode Capacitance (pF)

10

Maximum Power Dissipation (mW)

250

Peak Reverse Recovery Time (ns)

5

Minimum Operating Temperature (°C)

-55

Maximum Operating Temperature (°C)

150

Supplier Temperature Grade

Automotive

Automotive

Yes

AEC Qualified Number

AEC-Q101

Standard Package Name

SOT

Supplier Package

SOT-23

Military

No

Mounting

Surface Mount

Package Height

1(Max)

Package Length

3(Max)

Package Width

1.4(Max)

PCB changed

3

Lead Shape

Gull-wing

Package

Bulk

Base Product Number

BAT54

Mfr

NXP USA Inc.

Product Status

Active

Packaging

Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

Tape and Reel

Series

*

Part Status

Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

Active

Type

Schottky Diode

Pin Count

a count of all of the component leads (or pins)

3

Configuration

Dual Series

RoHS Status

RoHS means “Restriction of Certain Hazardous Substances” in the “Hazardous Substances Directive” in electrical and electronic equipment.

RoHS Compliant