NXP Semiconductors BAS32L,115

Mounting Type

Surface Mount

Package / Case

DO-213AC, MINI-MELF, SOD-80

Supplier Device Package

LLDS; MiniMelf

PCB changed

2

Peak Reverse Repetitive Voltage (V)

100

Maximum DC Reverse Voltage (V)

75

HTS

8541.10.00.80

ECCN (US)

EAR99

Package Length

3.7(Max)

Mounting

Surface Mount

Military

No

Supplier Package

Mini-MELF

AEC Qualified

No

Maximum Operating Temperature (°C)

200

Minimum Operating Temperature (°C)

-65

Peak Reverse Recovery Time (ns)

4

Maximum Power Dissipation (mW)

500

Peak Reverse Current (uA)

5

Peak Forward Voltage (V)

Peak Non-Repetitive Surge Current (A)

4

Maximum Continuous Forward Current (A)

0.2

Package

Bulk

Mfr

NXP Semiconductors

Product Status

Active

Packaging

Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

Tape and Reel

Series

-

Part Status

Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

Active

Type

Switching Diode

Pin Count

a count of all of the component leads (or pins)

2

Configuration

Single

Speed

Small Signal =< 200mA (Io), Any Speed

Diode Type

Standard

Current - Reverse Leakage @ Vr

5 µA @ 75 V

Voltage - Forward (Vf) (Max) @ If

1 V @ 100 mA

Operating Temperature - Junction

200°C (Max)

Voltage - DC Reverse (Vr) (Max)

75 V

Current - Average Rectified (Io)

200mA

Capacitance @ Vr, F

2pF @ 0V, 1MHz

Reverse Recovery Time (trr)

4 ns

Diameter

1.6(Max)

RoHS Status

RoHS means “Restriction of Certain Hazardous Substances” in the “Hazardous Substances Directive” in electrical and electronic equipment.

Yes with exemptions