NXP Semiconductors 74LVT04PW,118

ECCN (US)

EAR99

HTS

8542.39.00.01

Logic Family

LVT

Number of Elements per Chip

6

Maximum Propagation Delay Time @ Maximum CL (ns)

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Absolute Propagation Delay Time (ns)

4.7

Process Technology

BiCMOS

Maximum Low Level Output Current (mA)

32

Maximum High Level Output Current (mA)

-20

Minimum Operating Supply Voltage (V)

2.7

Typical Operating Supply Voltage (V)

3.3

Maximum Operating Supply Voltage (V)

3.6

Typical Quiescent Current (uA)

1500

Maximum Quiescent Current (uA)

3000

Propagation Delay Test Condition (pF)

50

Minimum Operating Temperature (°C)

-40

Maximum Operating Temperature (°C)

85

Supplier Package

TSSOP

Mounting

Surface Mount

Package Height

0.95(Max)

Package Length

5.1(Max)

Package Width

4.5(Max)

PCB changed

14

Package

Bulk

Mfr

NXP USA Inc.

Product Status

Active

Packaging

Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

Tape and Reel

Series

*

Part Status

Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

Active

Pin Count

a count of all of the component leads (or pins)

14

Logic Function

Inverter

RoHS Status

RoHS means “Restriction of Certain Hazardous Substances” in the “Hazardous Substances Directive” in electrical and electronic equipment.

RoHS Compliant