NXP Semiconductors 74LVC1G04GW,125

PCB changed

5

HTS

8542.39.00.01

ECCN (US)

EAR99

Package Width

1.35(Max)

Package Length

2.25(Max)

Package Height

1(Max)

Mounting

Surface Mount

Supplier Package

TSSOP

Standard Package Name

SOP

Maximum Operating Temperature (°C)

125

Minimum Operating Temperature (°C)

-40

Propagation Delay Test Condition (pF)

50

Maximum Quiescent Current (uA)

4

Typical Quiescent Current (uA)

0.1

Maximum Operating Supply Voltage (V)

5.5

Typical Operating Supply Voltage (V)

3.3|5|2.5|1.8

Minimum Operating Supply Voltage (V)

1.65

Maximum Low Level Output Voltage (V)

0.55

Minimum High Level Output Voltage (V)

1.2

Maximum High Level Output Current (mA)

-32

Maximum Low Level Output Current (mA)

32

Process Technology

CMOS

Absolute Propagation Delay Time (ns)

9.5

Maximum Propagation Delay Time @ Maximum CL (ns)

2(Typ)@3.3V|1.6(Typ)@5V|2.3(Typ)@2.7V

Number of Elements per Chip

1

Logic Family

LVC

Package

Bulk

Base Product Number

74LVC1

Mfr

NXP USA Inc.

Product Status

Active

Packaging

Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

Tape and Reel

Series

*

Part Status

Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

Active

Pin Count

a count of all of the component leads (or pins)

5

Logic Function

Inverter

RoHS Status

RoHS means “Restriction of Certain Hazardous Substances” in the “Hazardous Substances Directive” in electrical and electronic equipment.

RoHS Compliant