NXP Semiconductors 74AHC1G125GW,165

PCB changed

5

Number of Inputs per Chip

1

Number of Channels per Chip

1

Number of Elements per Chip

1

Logic Family

AHC

ECCN (US)

EAR99

Maximum Quiescent Current (uA)

1

Maximum Operating Supply Voltage (V)

5.5

Typical Operating Supply Voltage (V)

5

Minimum Operating Supply Voltage (V)

2

Maximum High Level Output Current (mA)

-8

Maximum Low Level Output Current (mA)

8

Input Signal Type

Single-Ended

Process Technology

CMOS

Absolute Propagation Delay Time (ns)

16.5

Maximum Propagation Delay Time @ Maximum CL (ns)

11.5@3V to 3.6V|[email protected] to 5.5V

Bus Hold

No

Number of Output Enables per Chip

1 Low

Number of Outputs per Chip

1

Number of Input Enables per Chip

0

Package Width

1.35(Max)

Package Length

2.25(Max)

Package Height

1(Max)

Mounting

Surface Mount

Supplier Package

TSSOP

Maximum Operating Temperature (°C)

125

Minimum Operating Temperature (°C)

-40

Maximum Power Dissipation (mW)

250

Propagation Delay Test Condition (pF)

50

Packaging

Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

Tape and Reel

Part Status

Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

Obsolete

Pin Count

a count of all of the component leads (or pins)

5

Output Type

3-State

Polarity

Non-Inverting

Logic Function

Buffer/Line Driver

RoHS Status

RoHS means “Restriction of Certain Hazardous Substances” in the “Hazardous Substances Directive” in electrical and electronic equipment.

RoHS Compliant