NXP Semiconductors 74LVC1G04GM,115

ECCN (US)

EAR99

HTS

8542.39.00.01

Logic Family

LVC

Number of Elements per Chip

1

Maximum Propagation Delay Time @ Maximum CL (ns)

2(Typ)@3.3V|2.3(Typ)@2.7V|1.6(Typ)@5V

Absolute Propagation Delay Time (ns)

9.5

Process Technology

CMOS

Maximum Low Level Output Current (mA)

32

Maximum High Level Output Current (mA)

-32

Minimum High Level Output Voltage (V)

1.2

Maximum Low Level Output Voltage (V)

0.55

Minimum Operating Supply Voltage (V)

1.65

Typical Operating Supply Voltage (V)

5|1.8|2.5|3.3

Maximum Operating Supply Voltage (V)

5.5

Typical Quiescent Current (uA)

0.1

Maximum Quiescent Current (uA)

4

Propagation Delay Test Condition (pF)

50

Minimum Operating Temperature (°C)

-40

Maximum Operating Temperature (°C)

125

Standard Package Name

SON

Supplier Package

XSON

Mounting

Surface Mount

Package Height

0.46(Max)

Package Length

1.45

Package Width

1

PCB changed

6

Packaging

Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

Tape and Reel

Part Status

Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

Active

Pin Count

a count of all of the component leads (or pins)

6

Logic Function

Inverter

RoHS Status

RoHS means “Restriction of Certain Hazardous Substances” in the “Hazardous Substances Directive” in electrical and electronic equipment.

RoHS Compliant