MFS8632BMBA0ESR2

NXP MFS8632BMBA0ESR2

Part No:

MFS8632BMBA0ESR2

Manufacturer:

NXP

Datasheet:

-

Package:

-

AINNX NO:

35658019-MFS8632BMBA0ESR2

Category:

Specialized

Description:

Fail Safe Safety System Basis Chip FS8632 48-Pin HPQFN EP

Products specifications
  • Qualification
    AEC-Q100
  • Factory Pack QuantityFactory Pack Quantity
    4000
  • Part # Aliases
    935432996528
  • Manufacturer
    NXP
  • Brand
    NXP Semiconductors
  • RoHS
    Details
  • Series
    FS8600
  • Packaging

    Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

    Reel
  • Subcategory
    PMIC - Power Management ICs
  • Product Type

    a group of products which fulfill a similar need for a market segment or market as a whole.

    Power Management Specialized - PMIC
  • Product Category

    a particular group of related products.

    Power Management Specialized - PMIC
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