MFS8630BMBA0ES

NXP MFS8630BMBA0ES

Part No:

MFS8630BMBA0ES

Manufacturer:

NXP

Datasheet:

-

Package:

48-VFQFN Exposed Pad

AINNX NO:

35658552-MFS8630BMBA0ES

Category:

Specialized

Description:

Fail Safe Safety System Basis Chip FS8630 48-Pin HPQFN EP

Products specifications
  • Mounting Type
    Surface Mount
  • Package / Case
    48-VFQFN Exposed Pad
  • Supplier Device Package
    48-QFN (7x7)
  • Qualification
    AEC-Q100
  • Factory Pack QuantityFactory Pack Quantity
    260
  • Part # Aliases
    935432767557
  • Manufacturer
    NXP
  • Brand
    NXP Semiconductors
  • RoHS
    Details
  • Package
    Tray
  • Mfr
    NXP USA Inc.
  • Product Status
    Active
  • Series
    FS8600
  • Packaging

    Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

    Tray
  • Operating Temperature

    The operating temperature is the range of ambient temperature within which a power supply, or any other electrical equipment, operate in. This ranges from a minimum operating temperature, to a peak or maximum operating temperature, outside which, the power supply may fail.

    -40°C ~ 125°C (TA)
  • Applications
    Camera
  • Subcategory
    PMIC - Power Management ICs
  • Voltage - Supply
    4.5V ~ 36V
  • Current - Supply
    -
  • Product Type

    a group of products which fulfill a similar need for a market segment or market as a whole.

    Power Management Specialized - PMIC
  • Product Category

    a particular group of related products.

    Power Management Specialized - PMIC
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