MC33FS6515LAER2
-
35660190-MC33FS6515LAER2
Safety Power System Basis Chip with CAN FD and LIN Interface DC-DC 1.5A 48-Pin LQFP T/R
Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.
a group of products which fulfill a similar need for a market segment or market as a whole.
a particular group of related products.