Micron Technology M29W640DT90N6E

Surface Mount

having leads that are designed to be soldered on the side of a circuit board that the body of the component is mounted on.

YES

Number of Terminals

48

EU RoHS

Compliant

ECCN (US)

3A991.b.1.a

Automotive

No

PPAP

No

Cell Type

NOR

Chip Density (bit)

64M

Block Organization

Asymmetrical

Location of Boot Block

Top

Address Bus Width (bit)

23/22

Number of Bits/Word (bit)

8/16

Number of Words

8M/4M

Programmability

Yes

Timing Type

Asynchronous

Max. Access Time (ns)

90

Maximum Erase Time (S)

400/Chip

Maximum Programming Time (ms)

400000/Chip

OE Access Time (ns)

35

Interface Type

Parallel

Minimum Operating Supply Voltage (V)

2.7

Typical Operating Supply Voltage (V)

3|3.3

Maximum Operating Supply Voltage (V)

3.6

Programming Voltage (V)

2.7 to 3.6|11.5 to 12.5

Operating Current (mA)

10

Program Current (mA)

20

Minimum Operating Temperature (°C)

-40

Maximum Operating Temperature (°C)

85

Supplier Temperature Grade

Industrial

Command Compatible

Yes

ECC Support

No

Support of Page Mode

No

Minimum Endurance (Cycles)

100000

Mounting

Surface Mount

Package Height

1

Package Width

18.4

Package Length

12

PCB changed

48

Standard Package Name

SOP

Supplier Package

TSOP

Lead Shape

Gull-wing

Package Description

12 X 20 MM, LEAD FREE, PLASTIC, TSOP-48

Package Style

SMALL OUTLINE, THIN PROFILE

Number of Words Code

4000000

Package Body Material

PLASTIC/EPOXY

Package Equivalence Code

TSSOP48,.8,20

Operating Temperature-Min

-40 °C

Reflow Temperature-Max (s)

30

Access Time-Max

90 ns

Operating Temperature-Max

85 °C

Rohs Code

Yes

Manufacturer Part Number

M29W640DT90N6E

Supply Voltage-Nom (Vsup)

3 V

Package Code

TSOP1

Package Shape

RECTANGULAR

Manufacturer

STMicroelectronics

Part Life Cycle Code

Transferred

Ihs Manufacturer

STMICROELECTRONICS

Risk Rank

5.06

Part Package Code

TSOP

Packaging

Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

Tray

JESD-609 Code

e3/e6

Part Status

Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

Obsolete

ECCN Code

3A991.B.1.A

Type

NOR TYPE

Terminal Finish

TIN/TIN BISMUTH

Additional Feature

Any Feature, including a modified Existing Feature, that is not an Existing Feature.

TOP BOOT BLOCK

HTS Code

HTS (Harmonized Tariff Schedule) codes are product classification codes between 8-1 digits. The first six digits are an HS code, and the countries of import assign the subsequent digits to provide additional classification. U.S. HTS codes are 1 digits and are administered by the U.S. International Trade Commission.

8542.32.00.51

Subcategory

Flash Memories

Technology

CMOS

Terminal Position

DUAL

Terminal Form

Occurring at or forming the end of a series, succession, or the like; closing; concluding.

GULL WING

Peak Reflow Temperature (Cel)

260

Number of Functions

1

Terminal Pitch

The center distance from one pole to the next.

0.5 mm

Reach Compliance Code

compliant

Pin Count

a count of all of the component leads (or pins)

48

JESD-30 Code

R-PDSO-G48

Qualification Status

An indicator of formal certification of qualifications.

Not Qualified

Supply Voltage-Max (Vsup)

3.6 V

Power Supplies

an electronic circuit that converts the voltage of an alternating current (AC) into a direct current (DC) voltage.?

3/3.3 V

Temperature Grade

Temperature grades represent a tire's resistance to heat and its ability to dissipate heat when tested under controlled laboratory test conditions.

INDUSTRIAL

Supply Voltage-Min (Vsup)

2.7 V

Operating Mode

A phase of operation during the operation and maintenance stages of the life cycle of a facility.

ASYNCHRONOUS

Supply Current-Max

0.02 mA

Architecture

Sectored

Organization

4MX16

Seated Height-Max

1.2 mm

Memory Width

16

Standby Current-Max

0.0001 A

Memory Density

67108864 bit

Parallel/Serial

PARALLEL

Memory IC Type

FLASH

Programming Voltage

A special high-voltage supply that supplies the potential and energy for altering the state of certain nonvolatile memory arrays. On some devices, the presence of VPP also acts as a program enable signal (P).

3 V

Alternate Memory Width

8

Data Polling

YES

Toggle Bit

YES

Command User Interface

YES

Number of Sectors/Size

8,127

Sector Size

8Kbyte x 8|64Kbyte x 127

Ready/Busy

YES

Boot Block

Yes

Common Flash Interface

YES

Width

12 mm

Length

18.4 mm