DSPIC30F2010-30I/S

Microchip Technology Inc DSPIC30F2010-30I/S

Part No:

DSPIC30F2010-30I/S

Package:

-

AINNX NO:

69233370-DSPIC30F2010-30I/S

Description:

Description: 16-BIT

Products specifications
  • Surface Mount

    having leads that are designed to be soldered on the side of a circuit board that the body of the component is mounted on.

    YES
  • Number of Terminals
    28
  • Rohs Code
    Yes
  • Part Life Cycle Code
    Active
  • Ihs Manufacturer
    MICROCHIP TECHNOLOGY INC
  • Part Package Code
    DIE
  • Package Description
    WAFFLE PACK
  • Clock Frequency-Max
    40 MHz
  • Number of I/O Lines
    20
  • Operating Temperature-Max
    85 °C
  • Operating Temperature-Min
    -40 °C
  • Package Body Material
    UNSPECIFIED
  • Package Code
    DIE
  • Package Shape
    UNSPECIFIED
  • Package Style
    UNCASED CHIP
  • RAM(byte)
    512
  • ROM(word)
    4096
  • Supply Voltage-Max
    5.5 V
  • Supply Voltage-Min
    2.5 V
  • Supply Voltage-Nom
    3 V
  • JESD-609 Code
    e3
  • Pbfree Code
    Yes
  • ECCN Code
    3A991.A.2
  • Terminal Finish
    MATTE TIN
  • Additional Feature

    Any Feature, including a modified Existing Feature, that is not an Existing Feature.

    OPERATES AT 2.5 V MINIMUM SUPPLY @ 10 MHZ
  • HTS Code

    HTS (Harmonized Tariff Schedule) codes are product classification codes between 8-1 digits. The first six digits are an HS code, and the countries of import assign the subsequent digits to provide additional classification. U.S. HTS codes are 1 digits and are administered by the U.S. International Trade Commission.

    8542.31.00.01
  • Terminal Position
    UPPER
  • Terminal Form

    Occurring at or forming the end of a series, succession, or the like; closing; concluding.

    NO LEAD
  • Reach Compliance Code
    compliant
  • JESD-30 Code
    X-XUUC-N
  • Qualification Status

    An indicator of formal certification of qualifications.

    Not Qualified
  • Temperature Grade

    Temperature grades represent a tire's resistance to heat and its ability to dissipate heat when tested under controlled laboratory test conditions.

    INDUSTRIAL
  • Speed
    30 MHz
  • uPs/uCs/Peripheral ICs Type
    DIGITAL SIGNAL PROCESSOR, CONTROLLER
  • Supply Current-Max
    300 mA
  • Bit Size
    16
  • Has ADC
    YES
  • DMA Channels
    NO
  • PWM Channels
    YES
  • DAC Channels
    NO
  • On Chip Program ROM Width
    24
  • Boundary Scan
    NO
  • Low Power Mode
    YES
  • Screening Level
    TS 16949
  • Format
    FLOATING POINT
  • Integrated Cache
    NO
  • RAM (words)
    512
  • Number of Timers
    3
  • ROM Programmability
    FLASH
  • Number of External Interrupts
    3
  • Barrel Shifter
    YES
  • Internal Bus Architecture
    MULTIPLE
  • On Chip Data RAM Width
    8
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