Microchip DSPIC33CK512MP606-I/MR

Mounting Type

Free Hanging (In-Line)

Package / Case

QFN-64

Mounting Feature

a process by which the operating system makes files and directories on a storage device (such as hard drive, CD-ROM, or network share) available for users to access via the computer's file system.

-

Shell Material

Aluminum Alloy

Supplier Device Package

64-QFN (9x9)

Voltage, Rating

-

Package

Bulk

Primary Material

Metal

Base Product Number

VG952

Mfr

ITT Cannon, LLC

Product Status

Active

Contact Finish Mating

Silver

Package Type

QFN

MSL

MSL 3 - 168 hours

Instruction Type

Fixed/Floating Point

L1 Cache Instruction Memory

-

Watchdog Timers

Watchdog Timer

Maximum Clock Frequency

70 MHz

Maximum Operating Temperature

the maximum body temperature at which the thermistor is designed to operate for extended periods of time with acceptable stability of its electrical characteristics.

+ 85 C

Supply Voltage-Max

3.6 V

Minimum Operating Temperature

- 40 C

Factory Pack QuantityFactory Pack Quantity

40

Supply Voltage-Min

3 V

Mounting Styles

SMD/SMT

Interface Type

CAN, I2C, SPI, UART

Manufacturer

Microchip

Brand

Microchip Technology / Atmel

L1 Cache Data Memory

-

Data RAM Size

64 kB

Number of I/Os

53

Data Converters

A/D 20x12b SAR; D/A 6x12b

Operating Temperature

The operating temperature is the range of ambient temperature within which a power supply, or any other electrical equipment, operate in. This ranges from a minimum operating temperature, to a peak or maximum operating temperature, outside which, the power supply may fail.

-55°C ~ 125°C

Series

VG 95234, CA-B

Packaging

Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

Tube

Termination

Crimp

Connector Type

Plug, Female Sockets

Number of Positions

4

Color

Olive Drab

Fastening Type

There are 5 Main Types of Fastening Type: Screws, Nails, Bolts, Anchors, Rivets.

Reverse Bayonet Lock

Subcategory

Embedded Processors & Controllers

Current Rating (Amps)

74A

Orientation

X

Shielding

Shielded

Ingress Protection

Ingress Protection rating (or just IP rating), is an international standard (IEC 60529) used to rate the degree of protection or sealing effectiveness in electrical enclosures against intrusion of objects, water, dust or accidental contact. It corresponds to the European standard EN 60529.

IP67 - Dust Tight, Waterproof

Shell Finish

Olive Drab Cadmium

Pin Count

a count of all of the component leads (or pins)

64

Shell Size - Insert

22-22

Operating Supply Voltage

The voltage level by which an electrical system is designated and to which certain operating characteristics of the system are related.

3 V to 3.6 V

Oscillator Type

Wien Bridge Oscillator; RC Phase Shift Oscillator; Hartley Oscillator; Voltage Controlled Oscillator; Colpitts Oscillator; Clapp Oscillators; Crystal Oscillators; Armstrong Oscillator.

Internal

Speed

100MIPs

RAM Size

64K x 8

Shell Size, MIL

-

Voltage - Supply (Vcc/Vdd)

3V ~ 3.6V

Core Processor

dsPIC

Peripherals

Brown-out Detect/Reset, DMA, I²S, Motor Control, POR, PWM, QEI, WDT

Program Memory Type

Program memory typically refers to flash memory when it is used to hold the program (instructions). Program memory may also refer to a hard drive or solid state drive (SSD). Contrast with data memory.

Flash

Core Size

16-Bit

Program Memory Size

512 kB

Connectivity

CANbus, I²C, IrDA, LINbus, SPI, UART/USART

Data Bus Width

16 bit

Number of Timers/Counters

1 X 16 bit

Product Type

a group of products which fulfill a similar need for a market segment or market as a whole.

DSP - Digital Signal Processors & Controllers

EEPROM Size

-

Number of Cores

1 Core

Product

DSPs

Features

Backshell

Product Category

a particular group of related products.

Digital Signal Processors & Controllers - DSP, DSC

Device Core

Used in casting and moulding processes to produce internal cavities and reentrant angles (an interior angle that is greater than 18°).

dsPIC

Contact Finish Thickness - Mating

196.9µin (5.00µm)