Microchip Technology dsPIC33CK256MC502-E/SS

Mounting Type

Surface Mount

Package / Case

28-SSOP (0.209, 5.30mm Width)

Supplier Device Package

28-SSOP

RoHS

Details

Core

dsPIC33CK

Maximum Clock Frequency

100 MHz

L1 Cache Instruction Memory

-

L1 Cache Data Memory

-

Data RAM Size

32 kB

Factory Pack QuantityFactory Pack Quantity

47

Number of I/Os

21

Package

Tube

Mfr

Microchip Technology

Data Converters

A/D 13x12b SAR; D/A 2x12b

Product Status

Active

Mounting Styles

SMD/SMT

Packaging

Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

Tube

Operating Temperature

The operating temperature is the range of ambient temperature within which a power supply, or any other electrical equipment, operate in. This ranges from a minimum operating temperature, to a peak or maximum operating temperature, outside which, the power supply may fail.

-40°C ~ 125°C (TA)

Series

dsPIC™ 33CK, Functional Safety (FuSa)

Oscillator Type

Wien Bridge Oscillator; RC Phase Shift Oscillator; Hartley Oscillator; Voltage Controlled Oscillator; Colpitts Oscillator; Clapp Oscillators; Crystal Oscillators; Armstrong Oscillator.

Internal

Speed

100MIPs

RAM Size

32K x 8

Voltage - Supply (Vcc/Vdd)

3V ~ 3.6V

Core Processor

dsPIC

Peripherals

Brown-out Detect/Reset, DMA, Motor Control PWM, POR, PWM, QEI, WDT

Program Memory Type

Program memory typically refers to flash memory when it is used to hold the program (instructions). Program memory may also refer to a hard drive or solid state drive (SSD). Contrast with data memory.

Flash

Core Size

16-Bit

Program Memory Size

256 kB

Connectivity

CANbus, I²C, IrDA, LINbus, SPI, Smart Card, UART/USART

Data Bus Width

16 bit

EEPROM Size

-