APTGT50DDA60T3G

Microchip Technology APTGT50DDA60T3G

Part No:

APTGT50DDA60T3G

Datasheet:

-

Package:

SP3-32

AINNX NO:

31026113-APTGT50DDA60T3G

Description:

IGBT Modules DOR CC3175View in Development Tools Selector

Products specifications
  • Lifecycle Status
    Production (Last Updated: 2 months ago)
  • Package / Case
    SP3-32
  • Mounting Type
    Chassis Mount
  • Mount
    Chassis Mount, Screw
  • Number of Pins
    32
  • Supplier Device Package
    SP3
  • RoHS
    Details
  • Collector- Emitter Voltage VCEO Max
    600 V
  • Pd - Power Dissipation
    176 W
  • Minimum Operating Temperature
    - 40 C
  • Maximum Operating Temperature

    the maximum body temperature at which the thermistor is designed to operate for extended periods of time with acceptable stability of its electrical characteristics.

    + 100 C
  • Maximum Gate Emitter Voltage
    20 V
  • Mounting Styles
    Chassis Mount
  • Factory Pack QuantityFactory Pack Quantity
    1
  • Package
    Bulk
  • Current-Collector (Ic) (Max)
    80 A
  • Base Product Number
    APTGT50
  • Mfr
    Microchip Technology
  • Product Status
    Active
  • Collector-Emitter Breakdown Voltage
    600 V
  • Packaging

    Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

    Tube
  • Operating Temperature

    The operating temperature is the range of ambient temperature within which a power supply, or any other electrical equipment, operate in. This ranges from a minimum operating temperature, to a peak or maximum operating temperature, outside which, the power supply may fail.

    -40°C ~ 175°C (TJ)
  • Series
    -
  • Max Operating Temperature

    The Maximum Operating Temperature is the maximum body temperature at which the thermistor is designed to operate for extended periods of time with acceptable stability of its electrical characteristics.

    175 °C
  • Min Operating Temperature
    -40 °C
  • Max Power Dissipation

    The maximum power that the MOSFET can dissipate continuously under the specified thermal conditions.

    176 W
  • Configuration
    Dual
  • Element Configuration

    The distribution of electrons of an atom or molecule (or other physical structure) in atomic or molecular orbitals.

    Dual
  • Power - Max
    176 W
  • Input
    Standard
  • Collector Emitter Voltage (VCEO)
    600 V
  • Max Collector Current
    80 A
  • Current - Collector Cutoff (Max)
    250 µA
  • Voltage - Collector Emitter Breakdown (Max)
    600 V
  • Input Capacitance

    The capacitance between the input terminals of an op amp with either input grounded. It is expressed in units of farads.

    3.15 nF
  • Vce(on) (Max) @ Vge, Ic
    1.9V @ 15V, 50A
  • Continuous Collector Current
    80
  • IGBT Type
    Trench Field Stop
  • NTC Thermistor

    resistors with a negative temperature coefficient, which means that the resistance decreases with increasing temperature.

    Yes
  • Input Capacitance (Cies) @ Vce
    3.15 nF @ 25 V
  • Product
    IGBT Silicon Modules
  • Radiation Hardening

    Radiation hardening is the process of making electronic components and circuits resistant to damage or malfunction caused by high levels of ionizing radiation, especially for environments in outer space (especially beyond the low Earth orbit), around nuclear reactors and particle accelerators, or during nuclear accidents or nuclear warfare.

    No
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