MACOM Technology Solutions PTFB213004F-V2-R0

Mounting Type

Surface Mount

Package / Case

H-37275-6/2

Supplier Device Package

H-37275-6/2

Packaging

Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

Strip

Part Status

Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

Obsolete

Frequency

2.17GHz

Current - Test

2.4 A

Gain

18dB

Forward Current-Max

65 V

Power - Output

60W

Voltage - Test

30 V