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MACOM Technology Solutions CGHV60170D-GP4
CGHV60170D-GP4
Die
68726106-CGHV60170D-GP4
RF MOSFET HEMT 50V DIE
- Package / CaseDie
- Supplier Device PackageDie
- Base Product NumberCGHV60170
- SeriesGaN
- Packaging
Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.
Tray - Part Status
Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.
Active - Frequency6GHz
- Current - Test260 mA
- Gain17dB
- Forward Current-Max150 V
- Power - Output170W
- Voltage - Test50 V
- Datasheets :
Quantity
Unit Price
Ext. Price
1+
$25,244.322755
$25,244.30
10+
$23,815.398847
$238,154.00
100+
$22,467.357403
$2,246,735.68
500+
$21,195.620182
$10,597,810.07
1000+
$19,995.868083
$19,995,868.08
* The above prices does not include taxes and freight rates, which will be calculated on the order pages.
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