Mount
Screw
Surface Mount
having leads that are designed to be soldered on the side of a circuit board that the body of the component is mounted on.
YES
Number of Pins
6
Number of Terminals
8
Transistor Element Material
SILICON
RoHS
Compliant
Package Description
FLANGE MOUNT, R-CDFM-F8
Package Style
FLANGE MOUNT
Package Body Material
CERAMIC, METAL-SEALED COFIRED
Reflow Temperature-Max (s)
NOT SPECIFIED
Operating Temperature-Max
200 °C
Rohs Code
Yes
Manufacturer Part Number
DU2880V
Package Shape
RECTANGULAR
Manufacturer
MACOM
Number of Elements
2
Part Life Cycle Code
Active
Ihs Manufacturer
M/A-COM TECHNOLOGY SOLUTIONS INC
Risk Rank
5.23
Drain Current-Max (ID)
8 A
Packaging
Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.
Bulk
ECCN Code
EAR99
Max Operating Temperature
The Maximum Operating Temperature is the maximum body temperature at which the thermistor is designed to operate for extended periods of time with acceptable stability of its electrical characteristics.
200 °C
Min Operating Temperature
-55 °C
Subcategory
FET General Purpose Power
Terminal Position
DUAL
Terminal Form
Occurring at or forming the end of a series, succession, or the like; closing; concluding.
FLAT
Peak Reflow Temperature (Cel)
NOT SPECIFIED
Reach Compliance Code
compliant
JESD-30 Code
R-CDFM-F8
Qualification Status
An indicator of formal certification of qualifications.
Not Qualified
Configuration
COMMON SOURCE, 2 ELEMENTS
Operating Mode
A phase of operation during the operation and maintenance stages of the life cycle of a facility.
ENHANCEMENT MODE
Transistor Application
AMPLIFIER
Polarity/Channel Type
N-CHANNEL
Continuous Drain Current (ID)
8 A
Gate to Source Voltage (Vgs)
20 V
Drain Current-Max (Abs) (ID)
8 A
DS Breakdown Voltage-Min
65 V
FET Technology
METAL-OXIDE SEMICONDUCTOR
Power Dissipation-Max (Abs)
159 W
Highest Frequency Band
VERY HIGH FREQUENCY BAND