MACOM Technology Solutions 2089-6206-00

Package / Case

71.2 mm x 25.4 mm x 9.7 mm

RoHS

N

Factory Pack QuantityFactory Pack Quantity

1

Package

Tray

Mfr

MACOM Technology Solutions

Product Status

Active

Rohs Code

No

Operating Frequency (Max)

2000 MHz

Manufacturer Part Number

2089-6206-00

Insertion Loss-Max

0.4 dB

Part Life Cycle Code

Active

Ihs Manufacturer

M/A-COM TECHNOLOGY SOLUTIONS INC

Risk Rank

5.3

Series

2089

Packaging

Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

Bulk

Size / Dimension

3.560 L x 1.000 W x 0.380 H (90.60mm x 25.40mm x 9.70mm)

Pbfree Code

No

Additional Feature

Any Feature, including a modified Existing Feature, that is not an Existing Feature.

SMA-F

Construction

COAXIAL

Reach Compliance Code

compliant

Frequency

500 MHz ~ 2 GHz

Specifications

a measure of a material's ability to?conduct heat.?

Isolation (Min) 20dB, 1.3 VSWR (Max), 4° Imbalance (Max)

RF/Microwave Device Type

SPLITTER

Insertion Loss

the loss of signal power resulting from the insertion of a device in a transmission line or optical fiber and is usually expressed in decibels (dB).

0.4dB

Operating Frequency-Min

500 MHz

VSWR-Max

1.3

Input Power-Max (CW)

45.57 dBm