2089-6208-00

MACOM Technology Solutions 2089-6208-00

Part No:

2089-6208-00

Datasheet:

-

Package:

Module, SMA Connectors

AINNX NO:

31189475-2089-6208-00

Description:

Signal Conditioning 2-18GHz IL 1.0dB VSWR 1.60:1

Products specifications
  • Package / Case
    Module, SMA Connectors
  • RoHS
    N
  • Factory Pack QuantityFactory Pack Quantity
    1
  • Unit Weight
    2.057030 oz
  • Package
    Tray
  • Mfr
    MACOM Technology Solutions
  • Product Status
    Active
  • Rohs Code
    No
  • Operating Frequency (Max)
    18000 MHz
  • Manufacturer Part Number
    2089-6208-00
  • Insertion Loss-Max
    1 dB
  • Part Life Cycle Code
    Active
  • Ihs Manufacturer
    M/A-COM TECHNOLOGY SOLUTIONS INC
  • Risk Rank
    5.23
  • Series
    2089
  • Packaging

    Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

    Bulk
  • Size / Dimension
    3.010 L x 1.000 W x 0.380 H (76.60mm x 25.40mm x 9.70mm)
  • Pbfree Code
    No
  • Additional Feature

    Any Feature, including a modified Existing Feature, that is not an Existing Feature.

    SMA-F
  • Construction
    COAXIAL
  • Reach Compliance Code
    compliant
  • Frequency
    2 GHz ~ 18 GHz
  • Termination Style
    BNC
  • Specifications

    a measure of a material's ability to?conduct heat.?

    Isolation (Min) 17dB, 1.6 VSWR (Max), 8° Imbalance (Max)
  • Frequency Range

    A continuous range or spectrum of frequencies that extends from one limiting frequency to another.

    2 GHz to 18 GHz
  • RF/Microwave Device Type
    SPLITTER
  • Insertion Loss

    the loss of signal power resulting from the insertion of a device in a transmission line or optical fiber and is usually expressed in decibels (dB).

    1dB
  • Operating Frequency-Min
    2000 MHz
  • VSWR-Max
    1.6
  • Input Power-Max (CW)
    46.02 dBm
  • Product
    Power Dividers
0 Similar Products Remaining