MACOM Technology Solutions 2025-6017-06

Package / Case

Module, SMA Connectors

Supplier Device Package

-

RoHS

N

Factory Pack QuantityFactory Pack Quantity

1

Unit Weight

3 oz

Package

Tray

Mfr

MACOM Technology Solutions

Product Status

Active

Package Description

CASE 5

Operating Temperature-Min

-54 °C

Operating Temperature-Max

125 °C

Rohs Code

No

Operating Frequency (Max)

18000 MHz

Manufacturer Part Number

2025-6017-06

Insertion Loss-Max

0.7 dB

Part Life Cycle Code

Active

Ihs Manufacturer

M/A-COM TECHNOLOGY SOLUTIONS INC

Risk Rank

5.34

Packaging

Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

Bulk

Series

-

Applications

General Purpose

Additional Feature

Any Feature, including a modified Existing Feature, that is not an Existing Feature.

SMA

Construction

COAXIAL

Reach Compliance Code

compliant

Frequency

6GHz ~ 18GHz

Power - Max

50W

RF/Microwave Device Type

DIRECTIONAL COUPLER

Insertion Loss

the loss of signal power resulting from the insertion of a device in a transmission line or optical fiber and is usually expressed in decibels (dB).

0.7dB

Isolation

-

Operating Frequency-Min

6000 MHz

VSWR-Max

1.4

Input Power-Max (CW)

46.99 dBm

Return Loss

In telecommunications, return loss is a measure in relative terms of the power of the signal reflected by a discontinuity in a transmission line or optical fiber.

-

Coupler Type

Standard

Coupling Factor

Coupling Factor (CF) measures the coupling between classes excluding coupling due to inheritance. It is the ratio between the number of actually coupled pairs of classes in a scope (e.g., package) and the possible number of coupled pairs of classes. CF is primarily applicable to object-oriented systems.

6 ± 1dB

Product

Directional Couplers