MA-COM UF2810P

Surface Mount

having leads that are designed to be soldered on the side of a circuit board that the body of the component is mounted on.

YES

Number of Terminals

4

Transistor Element Material

SILICON

Package Description

FLANGE MOUNT, R-CDFM-F4

Package Style

FLANGE MOUNT

Package Body Material

CERAMIC, METAL-SEALED COFIRED

Reflow Temperature-Max (s)

NOT SPECIFIED

Operating Temperature-Max

200 °C

Rohs Code

Yes

Manufacturer Part Number

UF2810P

Package Shape

RECTANGULAR

Manufacturer

MACOM

Number of Elements

2

Part Life Cycle Code

Active

Ihs Manufacturer

M/A-COM TECHNOLOGY SOLUTIONS INC

Risk Rank

5.3

Drain Current-Max (ID)

1.4 A

ECCN Code

EAR99

Additional Feature

Any Feature, including a modified Existing Feature, that is not an Existing Feature.

LOW NOISE

Subcategory

FET General Purpose Power

Terminal Position

DUAL

Terminal Form

Occurring at or forming the end of a series, succession, or the like; closing; concluding.

FLAT

Peak Reflow Temperature (Cel)

NOT SPECIFIED

Reach Compliance Code

compliant

Pin Count

a count of all of the component leads (or pins)

4

JESD-30 Code

R-CDFM-F4

Qualification Status

An indicator of formal certification of qualifications.

Not Qualified

Configuration

COMMON SOURCE, 2 ELEMENTS

Operating Mode

A phase of operation during the operation and maintenance stages of the life cycle of a facility.

ENHANCEMENT MODE

Case Connection

SOURCE

Transistor Application

AMPLIFIER

Polarity/Channel Type

N-CHANNEL

Drain Current-Max (Abs) (ID)

1.4 A

DS Breakdown Voltage-Min

65 V

FET Technology

METAL-OXIDE SEMICONDUCTOR

Power Dissipation-Max (Abs)

26.9 W

Highest Frequency Band

ULTRA HIGH FREQUENCY BAND