IXTA64N10L2-TRL

Littelfuse IXTA64N10L2-TRL

Part No:

IXTA64N10L2-TRL

Manufacturer:

Littelfuse

Datasheet:

-

Package:

TO-263-3

AINNX NO:

31974986-IXTA64N10L2-TRL

Description:

Products specifications
  • Package / Case
    TO-263-3
  • EU RoHS
    Compliant
  • ECCN (US)
    EAR99
  • HTS
    8541.29.00.95
  • Automotive
    No
  • PPAP
    No
  • Category
    Power MOSFET
  • Channel Mode
    Enhancement
  • Number of Elements per Chip
    1
  • Maximum Drain Source Voltage (V)
    100
  • Maximum Gate Source Voltage (V)
    ±20
  • Maximum Gate Threshold Voltage (V)
    4.5
  • Maximum Continuous Drain Current (A)
    64
  • Maximum Gate Source Leakage Current (nA)
    100
  • Maximum IDSS (uA)
    5
  • Typical Gate Charge @ Vgs (nC)
    100@10V
  • Typical Gate Charge @ 10V (nC)
    100
  • Typical Input Capacitance @ Vds (pF)
    3620@25V
  • Maximum Power Dissipation (mW)
    357000
  • Typical Fall Time (ns)
    11
  • Typical Rise Time (ns)
    27
  • Typical Turn-Off Delay Time (ns)
    38
  • Typical Turn-On Delay Time (ns)
    14
  • Minimum Operating Temperature (°C)
    -55
  • Maximum Operating Temperature (°C)
    150
  • Mounting
    Surface Mount
  • Package Height
    4.7(Max)
  • Package Width
    9.4(Max)
  • Package Length
    10.41(Max)
  • PCB changed
    2
  • Tab
    Tab
  • Supplier Package
    D2PAK
  • Vds - Drain-Source Breakdown Voltage
    100 V
  • Vgs th - Gate-Source Threshold Voltage
    2.5 V
  • Pd - Power Dissipation
    357 W
  • Transistor Polarity
    N-Channel
  • Maximum Operating Temperature

    the maximum body temperature at which the thermistor is designed to operate for extended periods of time with acceptable stability of its electrical characteristics.

    + 150 C
  • Vgs - Gate-Source Voltage
    - 20 V, + 20 V
  • Minimum Operating Temperature
    - 55 C
  • Mounting Styles
    SMD/SMT
  • Qg - Gate Charge
    100 nC
  • Rds On - Drain-Source Resistance
    32 mOhms
  • Id - Continuous Drain Current
    64 A
  • Packaging

    Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

    Tape and Reel
  • Part Status

    Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

    Active
  • Technology
    Si
  • Pin Count

    a count of all of the component leads (or pins)

    3
  • Configuration
    Single
  • Number of Channels
    1 Channel
  • Channel Type
    N
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