Package / Case
TO-263-3
EU RoHS
Compliant
ECCN (US)
EAR99
HTS
8541.29.00.95
Automotive
No
PPAP
No
Category
Power MOSFET
Channel Mode
Enhancement
Number of Elements per Chip
1
Maximum Drain Source Voltage (V)
100
Maximum Gate Source Voltage (V)
±20
Maximum Gate Threshold Voltage (V)
4.5
Maximum Continuous Drain Current (A)
64
Maximum Gate Source Leakage Current (nA)
100
Maximum IDSS (uA)
5
Typical Gate Charge @ Vgs (nC)
100@10V
Typical Gate Charge @ 10V (nC)
100
Typical Input Capacitance @ Vds (pF)
3620@25V
Maximum Power Dissipation (mW)
357000
Typical Fall Time (ns)
11
Typical Rise Time (ns)
27
Typical Turn-Off Delay Time (ns)
38
Typical Turn-On Delay Time (ns)
14
Minimum Operating Temperature (°C)
-55
Maximum Operating Temperature (°C)
150
Mounting
Surface Mount
Package Height
4.7(Max)
Package Width
9.4(Max)
Package Length
10.41(Max)
PCB changed
2
Tab
Tab
Supplier Package
D2PAK
Vds - Drain-Source Breakdown Voltage
100 V
Vgs th - Gate-Source Threshold Voltage
2.5 V
Pd - Power Dissipation
357 W
Transistor Polarity
N-Channel
Maximum Operating Temperature
the maximum body temperature at which the thermistor is designed to operate for extended periods of time with acceptable stability of its electrical characteristics.
+ 150 C
Vgs - Gate-Source Voltage
- 20 V, + 20 V
Minimum Operating Temperature
- 55 C
Mounting Styles
SMD/SMT
Qg - Gate Charge
100 nC
Rds On - Drain-Source Resistance
32 mOhms
Id - Continuous Drain Current
64 A
Packaging
Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.
Tape and Reel
Part Status
Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.
Active
Technology
Si
Pin Count
a count of all of the component leads (or pins)
3
Configuration
Single
Number of Channels
1 Channel
Channel Type
N