Littelfuse IXFT50N60P3-TRL

Package / Case

TO-268-3

EU RoHS

Compliant with Exemption

ECCN (US)

EAR99

Automotive

No

PPAP

No

Category

Power MOSFET

Channel Mode

Enhancement

Number of Elements per Chip

1

Maximum Drain Source Voltage (V)

600

Maximum Gate Source Voltage (V)

±30

Maximum Continuous Drain Current (A)

50

Typical Gate Charge @ Vgs (nC)

94@10V

Typical Gate Charge @ 10V (nC)

94

Typical Input Capacitance @ Vds (pF)

6300@25V

Maximum Power Dissipation (mW)

1040000

Typical Fall Time (ns)

17

Typical Rise Time (ns)

20

Typical Turn-Off Delay Time (ns)

62

Typical Turn-On Delay Time (ns)

31

Minimum Operating Temperature (°C)

-55

Maximum Operating Temperature (°C)

150

Mounting

Surface Mount

Package Height

5.1(Max)

Package Width

14(Max)

Package Length

16.05(Max)

PCB changed

2

Tab

Tab

Supplier Package

TO-268

Vds - Drain-Source Breakdown Voltage

600 V

Vgs th - Gate-Source Threshold Voltage

3 V

Pd - Power Dissipation

1.04 mW

Vgs - Gate-Source Voltage

- 30 V, + 30 V

Mounting Styles

Through Hole

Qg - Gate Charge

94 nC

Rds On - Drain-Source Resistance

160 mOhms

Id - Continuous Drain Current

50 A

Packaging

Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

Tape and Reel

Part Status

Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

Active

Technology

Si

Pin Count

a count of all of the component leads (or pins)

3

Configuration

Single

Number of Channels

1 Channel

Channel Type

N