LAPIS RF071LAM4STR

Mounting Type

Surface Mount

Package / Case

SOD-128

Supplier Device Package

PMDTM

Lead Free Status / RoHS Status

Lead free / RoHS Compliant

Other Names

RF071LAM4STRCT

Series

-

Packaging

Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

Cut Tape (CT)

Moisture Sensitivity Level (MSL)

1 (Unlimited)

Speed

Fast Recovery = 200mA (Io)

Diode Type

Standard

Current - Reverse Leakage @ Vr

10µA @ 400V

Voltage - Forward (Vf) (Max) @ If

1.25V @ 700mA

Operating Temperature - Junction

150°C (Max)

Voltage - DC Reverse (Vr) (Max)

400V

Current - Average Rectified (Io)

1A

Capacitance @ Vr, F

-

Reverse Recovery Time (trr)

25ns