LAPIS RBR2LAM60BTFTR

Mounting Type

Surface Mount

Package / Case

SOD-128

Supplier Device Package

PMDTM

RoHS

Compliant

Lead Free Status / RoHS Status

Lead free / RoHS Compliant

Other Names

RBR2LAM60BTFCT

Series

Automotive, AEC-Q101

Packaging

Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

Cut Tape (CT)

Moisture Sensitivity Level (MSL)

1 (Unlimited)

Speed

Fast Recovery = 200mA (Io)

Diode Type

Schottky

Current - Reverse Leakage @ Vr

150µA @ 60V

Operating Temperature - Junction

150°C (Max)

Voltage - DC Reverse (Vr) (Max)

60V

Current - Average Rectified (Io)

2A

Capacitance @ Vr, F

-