LAPIS RB081LAM-20TR

Mounting Type

Surface Mount

Package / Case

SOD-128

Supplier Device Package

PMDTM

Lead Free Status / RoHS Status

Lead free / RoHS Compliant

Other Names

RB081LAM-20TRDKR

Series

-

Packaging

Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

Original-Reel®

Moisture Sensitivity Level (MSL)

1 (Unlimited)

Speed

Fast Recovery = 200mA (Io)

Diode Type

Schottky

Current - Reverse Leakage @ Vr

700µA @ 20V

Voltage - Forward (Vf) (Max) @ If

450mV @ 5A

Operating Temperature - Junction

125°C (Max)

Voltage - DC Reverse (Vr) (Max)

20V

Current - Average Rectified (Io)

5A

Capacitance @ Vr, F

-