BR93G46F-3AGTE2

LAPIS BR93G46F-3AGTE2

Part No:

BR93G46F-3AGTE2

Manufacturer:

LAPIS

Datasheet:

-

Package:

8-SOIC (0.173, 4.40mm Width)

AINNX NO:

40847792-BR93G46F-3AGTE2

Category:

Memory

Description:

Products specifications
  • Mounting Type
    Surface Mount
  • Package / Case
    8-SOIC (0.173, 4.40mm Width)
  • Supplier Device Package
    8-SOP
  • Package
    Bulk
  • Mfr
    Panduit Corp
  • Product Status
    Obsolete
  • Lead Free Status / RoHS Status
    Lead free / RoHS Compliant
  • Other Names
    BR93G46F-3AGTE2DKR
  • Memory Types
    Non-Volatile
  • Series
    -
  • Operating Temperature

    The operating temperature is the range of ambient temperature within which a power supply, or any other electrical equipment, operate in. This ranges from a minimum operating temperature, to a peak or maximum operating temperature, outside which, the power supply may fail.

    -40°C ~ 85°C (TA)
  • Packaging

    Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

    Original-Reel®
  • Moisture Sensitivity Level (MSL)
    1 (Unlimited)
  • Technology
    EEPROM
  • Voltage - Supply
    1.7 V ~ 5.5 V
  • Memory Size

    The memory capacity is the amount of data a device can store at any given time in its memory.

    1Kb (64 x 16)
  • Clock Frequency
    3MHz
  • Memory Format
    EEPROM
  • Memory Interface

    An external memory interface is a bus protocol for communication from an integrated circuit, such as a microprocessor, to an external memory device located on a circuit board.

    SPI
  • Write Cycle Time - Word, Page
    5ms
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