LAPIS BR95160-RMN6TP

Package / Case

TO-220-4, SMD

Mounting Type

Surface Mount

Supplier Device Package

TO-220-4

Package

Tape & Reel (TR)

Mfr

Vishay Foil Resistors (Division of Vishay Precision Group)

Product Status

Active

Lead Free Status / RoHS Status

Lead free / RoHS Compliant

Other Names

BR95160RMN6TP

Memory Types

Non-Volatile

Operating Temperature

The operating temperature is the range of ambient temperature within which a power supply, or any other electrical equipment, operate in. This ranges from a minimum operating temperature, to a peak or maximum operating temperature, outside which, the power supply may fail.

-55°C ~ 150°C

Series

VPR221SZ

Packaging

Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

Tape & Reel (TR)

Size / Dimension

0.615 L x 0.400 W (15.62mm x 10.16mm)

Tolerance

±0.1%

Moisture Sensitivity Level (MSL)

1 (Unlimited)

Number of Terminations

4

Temperature Coefficient

The resistance-change factor per degree Celsius of temperature change is called the temperature coefficient of resistance. This factor is represented by the Greek lower-case letter “alpha” (α). A positive coefficient for a material means that its resistance increases with an increase in temperature.

±0.2ppm/°C

Resistance

1 Ohms

Composition

Metal Foil

Power (Watts)

8W

Technology

EEPROM

Voltage - Supply

1.8 V ~ 5.5 V

Base Part Number

BR95160

Failure Rate

the frequency with which an engineered system or component fails, expressed in failures per unit of time. It is usually denoted by the Greek letter λ (lambda) and is often used in reliability engineering.

-

Memory Size

The memory capacity is the amount of data a device can store at any given time in its memory.

16Kb (2K x 8)

Clock Frequency

2MHz

Memory Format

EEPROM

Memory Interface

An external memory interface is a bus protocol for communication from an integrated circuit, such as a microprocessor, to an external memory device located on a circuit board.

SPI

Write Cycle Time - Word, Page

10ms

Features

Moisture Resistant, Non-Inductive

Height Seated (Max)

0.158 (4.01mm)