LAPIS BR24L02FJ-WE2

Mounting Type

Surface Mount

Package / Case

8-SOIC (0.154, 3.90mm Width)

Supplier Device Package

8-SOP-J

Package

Bulk

Mfr

Panduit Corp

Product Status

Active

For Use With/Related Products

Panels

Lead Free Status / RoHS Status

Lead free / RoHS Compliant

Other Names

BR24L02FJ-WE2-ND BR24L02FJ-WE2TR BR24L02FJWE2

Memory Types

Non-Volatile

Series

TX6A™

Operating Temperature

The operating temperature is the range of ambient temperature within which a power supply, or any other electrical equipment, operate in. This ranges from a minimum operating temperature, to a peak or maximum operating temperature, outside which, the power supply may fail.

-40°C ~ 85°C (TA)

Packaging

Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

Tape & Reel (TR)

Moisture Sensitivity Level (MSL)

1 (Unlimited)

Technology

EEPROM

Voltage - Supply

1.8 V ~ 5.5 V

Base Part Number

BR24L02

Memory Size

The memory capacity is the amount of data a device can store at any given time in its memory.

2Kb (256 x 8)

Accessory Type

Cable Management

Clock Frequency

400kHz

Memory Format

EEPROM

Memory Interface

An external memory interface is a bus protocol for communication from an integrated circuit, such as a microprocessor, to an external memory device located on a circuit board.

I²C

Write Cycle Time - Word, Page

5ms

Features

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