ZSSC3135BE1D

IDT ZSSC3135BE1D

Part No:

ZSSC3135BE1D

Manufacturer:

IDT

Datasheet:

-

Package:

-

AINNX NO:

43574488-ZSSC3135BE1D

Description:

DICE (WAFER SAWN) - WAFFLE PACK

Products specifications
  • Factory Pack QuantityFactory Pack Quantity
    1
  • Part # Aliases
    190472252 0190472252
  • Manufacturer
    Molex
  • Brand
    Molex
  • Package
    Tray
  • Base Product Number
    ZSSC3135
  • Mfr
    IDT, Integrated Device Technology Inc
  • Product Status
    Active
  • Series
    207125
  • Packaging

    Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

    Bulk
  • Subcategory
    Tools
  • Product Type

    a group of products which fulfill a similar need for a market segment or market as a whole.

    Punches & Dies
  • Product Category

    a particular group of related products.

    Punches & Dies
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