ZSSC3027AI1D ES

IDT ZSSC3027AI1D ES

Part No:

ZSSC3027AI1D ES

Manufacturer:

IDT

Datasheet:

-

Package:

-

AINNX NO:

43388904-ZSSC3027AI1D ES

Description:

DICE (WAFER SAWN) - WAFFLE PACK

Products specifications
  • Unit Weight
    0.003280 oz
  • Factory Pack QuantityFactory Pack Quantity
    3000
  • Manufacturer
    Micro Commercial Components (MCC)
  • Brand
    Micro Commercial Components (MCC)
  • RoHS
    Details
  • Package
    Tray
  • Base Product Number
    ZSSC3027
  • Mfr
    IDT, Integrated Device Technology Inc
  • Product Status
    Active
  • Series
    SKxx
  • Packaging

    Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

    Reel
  • Subcategory
    Diodes & Rectifiers
  • Technology
    Si
  • Product Type

    a group of products which fulfill a similar need for a market segment or market as a whole.

    Schottky Diodes & Rectifiers
  • Product Category

    a particular group of related products.

    Schottky Diodes & Rectifiers
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