ZSSC3123AI1D

IDT ZSSC3123AI1D

Part No:

ZSSC3123AI1D

Manufacturer:

IDT

Datasheet:

-

Package:

-

AINNX NO:

43957575-ZSSC3123AI1D

Description:

DICE (WAFER SAWN) - WAFFLE PACK

Products specifications
  • Factory Pack QuantityFactory Pack Quantity
    1000
  • Mounting Styles
    PCB Mount
  • Manufacturer
    TT Electronics
  • Brand
    Welwyn Components / TT Electronics
  • RoHS
    Details
  • Product Status
    Active
  • Mfr
    IDT, Integrated Device Technology Inc
  • Base Product Number
    ZSSC3123
  • Package
    Tray
  • Series
    PCF
  • Packaging

    Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

    Reel
  • Part Status

    Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

    Active
  • Subcategory
    Resistors
  • Technology
    Thin Film
  • Product Type

    a group of products which fulfill a similar need for a market segment or market as a whole.

    Thin Film Resistors
  • Product Category

    a particular group of related products.

    Thin Film Resistors - SMD
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