ZSSC3131BA1D
QFN
36820035-ZSSC3131BA1D
DICE (WAFER SAWN) - WAFFLE PACK
Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.
Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.
a count of all of the component leads (or pins)